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E2D0036-39-21 Semiconductor
Semiconductor MSM66V84B
4,194,304-word x 1-bit Serial Register
This version: Feb. 1999 MSM66V84B Previous version: May. 1997
GENERAL DESCRIPTION
MSM66V84B is a serial register organized as 4,194,304 words x one bit, characterized by mediumspeed, low power consumption operation. This device has a built-in internal address generation circuit allowing continuous serial read/write operation by external clock input. Read/write operation causes the internal address to be incremented automatically by +1. External address input enables addressing in units of 1024 words. Furthermore, a refresh timer and a refresh address counter are installed, which makes an external refresh circuit unnecessary. In addition, this configuration allows lower power consumption. The device is packaged in 26/20-pin SOJ or 26/20 TSOP having a width of 300 mil. It is well adapted for storing much data by means of a battery backup. Its combination with our recording and playback LSI enables the easy implementation of a solid recording and playback system.
FEATURES
* Configuration 4,194,304 x 1 bit * Serial access operation Serial access time : 1.5 ms Serial read/write time : 2.5 ms * Low current drain 100 mA max. (VCC = 3.6 V with data stored and under standard conditions) * Refresh operation A self-refresh function is supported. * Wide operation voltage range Single 2.7 to 3.6 V * Addressing Units of 1024 words * Process 0.45 mm double well CMOS process * Package options : 26/20-pin plastic SOJ (SOJ26/20-P-300-1.27) (Product name : MSM66V84BJS) 26/20-pin plastic TSOP (TSOPII26/20-P-300-1.27-K) (Product name : MSM66V84BTS-K)
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Semiconductor
MSM66V84B
BLOCK DIAGRAM
Refresh Timer
Row Decoder
Address Multiplexer
Refresh Address Counter
4,194,304 Data Register
TAS
Row Address Counter
Column Decoder SAS I/O Control SAD Row Address Register Column Address Counter Timing Generator
DIN
DOUT
RWCK
Write Clock Generator
WE
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Semiconductor
MSM66V84B
PIN CONFIGURATION (TOP VIEW)
TEST 1 RWCK 2 NC 3 TEST 4 TEST 5
26 VCC 25 TEST 24 TEST 23 SAD 22 SAS
TEST 1 RWCK 2 NC 3 TEST 4 TEST 5
26 VCC 25 TEST 24 TEST 23 SAD 22 SAS
TEST 9 TEST 10 DIN 11 NC 12 VSS 13
18 TAS 17 CS 16 WE 15 DOUT 14 NC
TEST 9 TEST 10 DIN 11 NC 12 VSS 13
18 TAS 17 CS 16 WE 15 DOUT 14 NC
NC : No connection 26/20-pin plastic SOJ
NC : No connection 26/20-pin plastic TSOP (K type)
PIN DESCRIPTION
Pin 25 1, 4, 5 9, 10, 24 2 11 13 15 16 17 18 22 23 26 Symbol TEST TEST RWCK DIN VSS DOUT WE CS TAS SAS SAD VCC Test input Test input Read/write clock Data input Ground (0 V) Data output Write enable Chip select Transfer address strobe Serial address strobe Serial address data Power supply (2.7 V to 3.6 V) Description
Note : All TEST pins are to be connected to the power supply. The TEST pin is to be referenced to the ground level.
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Semiconductor
MSM66V84B
ABSOLUTE MAXIMUM RATINGS
Parameter Pin Voltage Output Short-Circuit Current Power Dissipation Operating Temperature Storage Temperature Symbol VT IOS PD Top TSTG Condition Against VSS at Ta = 25 C Ta = 25 C Ta = 25 C -- -- Rating -0.5 to +4.6 50 1 0 to 70 -55 to +150 Unit V mA W C C
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70C) Parameter Supply Voltage Supply Voltage "H" Input Voltage "L" Input Voltage Symbol VCC VSS VIH VIL Min. 2.7 0 VCC - 0.3 -0.2 Typ. 3.0 0 VCC 0 Max. 3.6 0 VCC + 0.2 +0.5 Unit V V V V
ELECTRICAL CHARACTERISTICS
DC characteristics
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70C) Parameter "H" Output Voltage "L" Output Voltage Input Leakage Current Output Leakage Current Supply Current (Operation) Supply Current (Standby) Symbol VOH VOL IIL IOL ICC1 ICC2 Condition IOH = -0.1 mA IOL = 0.1 mA VI = 0 V to VCC VO = 0 V to VCC VCC = 3.6 V, tRWC = 2.5 ms VCC = 3.6 V Min. VCC - 0.5 -- -1 -1 -- -- Max. -- 0.4 +1 +1 10 100 Unit V V mA mA mA mA
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Semiconductor AC Characteristics
MSM66V84B
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70C) Parameter Read/Write Cycle Time Access Time Output Turn-off Delay Time I/O Signal Rise Time RWCK Pre-charge Time RWCK Pulse Time SAS Cycle Time SAS Pre-charge Time SAS Pulse Width Address Setup Time Adress Hold Time TAS Setup Time TAS . RWCK Setup Time TAS Pulse Width Read Instruction Setup Time Read Instruction Hold Time Write Instruction Setup Time Write Instruction Hold Time Write Instruction Pulse Width WE. RWCK Read Time Data Setup Time Data Hold Time RWCK. WE Delay Time Symbol tRWC tACC tOFF tT tRWP tRW tSSC tSAP tSAS tAS tAH tATS tTRS tTAS tRRS tRRH tWRS tWRH tWP tRWL tDS tDH tRWD Min. 2,500 -- 0 3 1,000 1,500 100 50 50 0 50 50 50 50 0 250 0 50 50 50 0 50 50 Max. -- 1,500 50 50 -- 10,000 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
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Semiconductor
Read/write and read/modify/write cycles
TIMING DIAGRAM
CS tRWC tTRS RWCK tSAS tSSC tSAP tRW tRWP
SAS tAS tAH
SAD
A0
A1
A12
tATS
tTAS
TAS tRRS tRRH tRWD
tRWL tWP tWRS tWRH
WE tDS tDH tDS tDH
DIN tACC tOFF
n+1
n+2
MSM66V84B
DOUT
n
n+1
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Semiconductor
MSM66V84B
PIN FUNCTIONS AND OPERATING MODES
* Serial address input (SAD) Pin used to enter start address for reading/writing. An address can be specified in units of 1024 words. 1024 words of address data can be entered through the pin as 13 bits (A0 to A12) of serial data. The 13th bit must be A12 as a dummy address, however. The A12 input level must be either "H" or "L". * Serial address strobe (SAS) This is a clock pin for latching serial address data into an internal register. * Address transfer strobe (TAS) This is an input pin for loading the internal address counter with serial address data latched in the address register. * Read/write clock (RWCK) This is a clock input pin for reading and writing information in the data register. The trailing edge of RWCK triggers off internal operation. In the reading mode, information in the data register is output to the DOUT pin. In the writing mode, the data register is loaded with DIN information. At the leading edge of RWCK, the internal address counter is incremented automatically by +1. * Write enable (WE) This is an input pin for selecting the read mode, the write mode, or the read-modify-write mode. When WE is "H", the read mode is set up and, when WE is "L", the write mode is set up. When the level is lowered from "H" to "L" with RWCK active, the read-modify-write mode is set up. * Data input (DIN) This is a pin for entering write data. Information on the data input pin is latched when the trailing edge of RWCK is encountered in the write mode and that of WE is encountered in the read/modify mode. * Data output (DOUT) The data output pin always provides high impedance as long as RWCK or CS is kept at "H". When "H" or "L" information is read, the output pin set at "H" or "L", and information read until RWCK returns to "H" is held. In the early write mode, the output pin is maintained at high impedance, so that, connect of DIN and DOUT enables "I/O common operation". * Chip selection (CS) This is an input pin for disabling all input pins. This pin allows the use of two or more MSM66V84B devices with data input and output pins connected in parallel. * Test (TEST, TEST) The TEST pin must always be fixed at "L" and the TEST pin at "H".
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Semiconductor
MSM66V84B
NOTES ON ENERGIZATION
MSM66V84B has built-in board bias generation and inner power supply circuits. Thus, energization must be followed by a pause period of 1 ms or more for internal circuit stabilization. Furthermore, the TEST pin must be brought "L" concurrently with or prior to VCC, and all clock input pins and TEST pins must be brought "H" concurrently with or prior to VCC. To achieve proper operation of internal circuits, the initial pause above must be followed by minimum ten dummy read cycles with RWCK.
NOTES ON SUPPLY VOLTAGE VARIATION
When using MSM66V84B, take precautions so that the supply voltage does not vary over one volt within a period of 1,000ms or less in the active state.
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Semiconductor
MSM66V84B
PACKAGE DIMENSIONS
(Unit : mm)
SOJ26/20-P-300-1.27
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.80 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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Semiconductor
MSM66V84B
(Unit : mm)
TSOPII26/20-P-300-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.38 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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E2Y0002-29-11
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation.
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Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan

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